January 19, 2016
Optional Clean & Double-Bag (CDB) Procedure
Optional High Purity Quality Assurance Procedure Class 100 Cleanroom
- This specification describes the cleaning procedure used for the cleaning of components and valves for DI Service.
- Cleaning and packing procedures are carried out in class 100 cleanroom.
- Rinse components with DI water.
- Flush component with 18 megohm DI water for a minimum of five minutes under 60 psi of water pressure. Optional 8 and 16 hour hot DI water flush under 60 psi water pressure are available.
- Scrub and clean component interior with designated soft nylon brush.
- Inspect component for smooth clean interior.
- Rinse component in clean DI water while rotating or otherwise agitating component. Rinse through stages, monitoring DI sensitivity for a minimum of 10 megohms. Particle test fluid stream to confirm 1 particle of 0.2 micron size of less per ml.
- Nitrogen wad or wipe with lint-free kleenwipe to remove excess water. Inspect kleenwipe for cleanliness.
- Purge/dry component using filtered nitrogen (99.999% pure) from a cryogenic source.
- Final inspection of component. Use a 3200-3800A wavelength black light in a non-lit area to inspect component and dried kleenwipes for any smudges/traces of fluorescent smears. Reclean if flouresing appears.
- While under purge, place component in a clean 6 Mil polyethylene sleeve and heat seal. Double bagging and label per customer requirements.